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MT41K256M16HA-125:E MT41K256M16HA-125:E MT41K256M16HA-125:E MT41K256M16HA-125:E
Description
DDR3L SDRAM (1.35V) is a low voltage version of the
DDR3 (1.5V) SDRAM. Refer to the DDR3 (1.5V)
SDRAM data sheet specifications when running in
1.5V compatible mode.
Features
• V DD = V DDQ = 1.35V (1.283–1.45V)
• Backward compatible to V DD = V DDQ = 1.5V ±0.075V
– Supports DDR3L devices to be backward com-
patible in 1.5V applications
• Differential bidirectional data strobe
• 8n-bit prefetch architecture
• Differential clock inputs (CK, CK#)
• 8 internal banks
• Nominal and dynamic on-die termination (ODT)
for data, strobe, and mask signals
• Programmable CAS (READ) latency (CL)
• Programmable posted CAS additive latency (AL)
• Programmable CAS (WRITE) latency (CWL)
• Fixed burst length (BL) of 8 and burst chop (BC) of 4
(via the mode register set [MRS])
• Selectable BC4 or BL8 on-the-fly (OTF)
• Self refresh mode
• T C of 0°C to +95°C
– 64ms, 8192-cycle refresh at 0°C to +85°C
– 32ms at +85°C to +95°C
• Self refresh temperature (SRT)
• Automatic self refresh (ASR)
• Write leveling
• Multipurpose register
• Output driver calibration
Options Marking
• Configuration
– 1 Gig x 4 1G4
– 512 Meg x 8 512M8
– 256 Meg x 16 256M16
• FBGA package (Pb-free) – x4, x8
– 78-ball (10.5mm x 12mm) Rev. D RA
– 78-ball (9mm x 10.5mm) Rev. E, J RH
• FBGA package (Pb-free) – x16
– 96-ball (10mm x 14mm) Rev. D RE
– 96-ball (9mm x 14mm) Rev. E HA
• Timing – cycle time
– 1.071ns @ CL = 13 (DDR3-1866) -107
– 1.25ns @ CL = 11 (DDR3-1600) -125
– 1.5ns @ CL = 9 (DDR3-1333) -15E
– 1.875ns @ CL = 7 (DDR3-1066) -187E
• Operating temperature
– Commercial (0°C ≤ T C ≤ +95°C) None
– Industrial (–40°C ≤ T C ≤ +95°C) IT
DRAM
SDRAM - DDR3L
4Gb (256M x 16)
96-FBGA(9x14)
0°C ~ 95°C(TC)
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