供应KLMAG1JETD-B041003 原装 eMMC

地区:广东 深圳
认证:

深圳市迅丰达电子科技有限公司

金牌会员3年

全部产品 进入商铺

KLMAG1JETD-B041003 原装 eMMC

Samsung eMMC Product family  eMMC 5.1 Specification compatibility


KLMAG1JETD-B041003 原装 eMMC  的描述:

SAMSUNG eMMC is an embedded MMC solution designed in a BGA package form. eMMC operation is identical to a MMC device and therefore is a simple read and write to memory using MMC protocol v5.1 which is a industry standard.


eMMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF or VCC) whereas 1.8V or 3V dual supply voltage (VDD or VCCQ) is supported for the MMC controller. SAMSUNG eMMC supports HS400 in order to improve sequential bandwidth, especially  sequential read performance.


There are several advantages of using eMMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host.

Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to faster product development as well as faster times to market.


The embedded flash management software or FTL(Flash Transition Layer) of eMMC manages Wear Leveling, Bad Block Management and ECC. The FTL supports all features of the Samsung NAND flash and achieves optimal performance.


KLMAG1JETD-B041003 原装 eMMC 的技术参数 :

容量

16GB(128GB*1)

电压

1.8, 3.3 V / 3.3 V

接口

HS400

封装尺寸

11.5 x 13 x 0.8 mm

温度

-25 ~ 85°C

Product Status

Mass Production

封装

FBGA-153


▊100%原装现货▊  有需求联系我们

MT29F64G08CBABBWPR:B

KLMBG2JETD-B041

KLMAG1JETD-B041

KLM8G1GETF-B041

KLM4G1FETE-B041

K4E8E324EB-EGCF

K4E6E304EB-EGCF

K4E6E304EC-EGCG

K4B4G1646E-BCNB

K4A8G165WB-BCRC

型号

KLMAG1JETD-B041003

制造商

SAMSUNG/三星

封装

FBGA

批次

22+

无铅/环保

无铅/环保