THGBMFG7C1LBAIL 原装 EMMC

THGBMFG7C1LBAIL 原装 EMMC的技术参数：

制造商	KIOXIA
型号	THGBMFG7C1LBAIL
封装	P-WFBGA
ROHS	是
存储密度	16GB
针脚数	153 PIN
产品类型	eMMC
尺寸	11.5mm x 13mm x 0.8mm(max)
工作温度	-25°C to +85°C
存储温度	-40°C to +85°C
电源电压	2.7V to 3.6V
架构	1 x 128Gbit
重量	0.18g

THGBMFG7C1LBAIL 原装 EMMC的描述：

THGBMFG7C1LBAIL is 16GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module.

THGBMFG7C1LBAIL has an industry standard MMC protocol for easy use.

THGBMFG7C1LBAIL has the JEDEC/MMCA Version 5.1 interface with either 1-I/O, 4-I/O and 8-I/O mode support.