高质量化金电路板 *化金pcb

华邦电子印制电路板技术指标

单面/双面Single/Double Sided P.C.B

*大加工面积Max Board Size           

400*900mm

板厚Board Thickess

0.4mm - 3.0mm

铜厚Copper Thickess

18um、36um、72um

基材Base Material

FR-4、CEM-1、CEM-3、铝基板

*小线宽The Min Track

0.2mm(1&plu*n;15%)

*小间隙The Min Clearence

0.2mm(1&plu*n;15%)

*小孔径The Min Cliameter

0.3mm&plu*n;0.1mm

孔壁厚度Hole Plating Thickness

≥18um

金属化孔孔径公差PTH Hole Tolerance

>∮0.8

&plu*n;0.10mm

≤∮0.8

&plu*n;0.05mm

孔位公差Hole Position Deviation

&plu*n;0.080mm

外型尺寸公差Outline Tolerance

&plu*n;0.20mm

*缘电阻Insulation Resistance

≥10^12欧姆（常态）

孔电阻Through Hole Resisance

≤300欧姆

*电强度Dielectric Strcemgth

≥1.6kv/mm

耐电流Current Breakdown

10A

*剥强度Peet-off Strength

1.5N/mm

阻焊剂硬度Solder Mask Abrasion

>5H

热冲击Thermal Strenss

288 C 5 C,10ses

自熄性Inflannabikity

94V-0

通断测试电压E-Test Voltage

10-250V

焊盘拉脱强度Pull of Strength of Peels

>100N

可焊性Sloder Ability

235℃ 55℃在3S内湿润

翘曲度Bow and Twist

≤0.75%