LFXP2-17E-5QN208C FPGA

地区:广东 深圳
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深圳市中立信电子科技有限公司

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LFXP2-17E-5QN208C

FPGA - 现场可编程门阵列 17KLUTs 201 I/O Inst -on DSP 1.2V -5 Spd


Features LFXP2-17E-5QN208C

 flexiFLASH™ Architecture

• Instant-on

• Infinitely reconfigurable

• Single chip

• FlashBAK™ technology

• Serial TAG memory

• Design security

 Live Update Technology

• TransFR™ technology

• Secure updates with 128 bit AES encryption

• Dual-boot with external SPI

 sysDSP™ Block

• Three to eight blocks for high performance

Multiply and Accumulate

• 12 to 32 18x18 multipliers LFXP2-17E-5QN208C

• Each block supports one 36x36 multiplier or four

18x18 or eight 9x9 multipliers

 Embedded and Distributed Memory

• Up to 885 Kbits sysMEM™ EBR

• Up to 83 Kbits Distributed RAM

 sysCLOCK™ PLLs

• Up to four analog PLLs per device

• Clock multiply, divide and phase shifting

Flexible I/O Buffer

• sysIO™ buffer supports: LFXP2-17E-5QN208C

– LVCMOS 33/25/18/15/12; LVTTL

– SSTL 33/25/18 class I, II

– HSTL15 class I; HSTL18 class I, II

– PCI

– LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS

 Pre-engineered Source Synchronous

Interfaces

• DDR / DDR2 interfaces up to 200 MHz

• 7:1 LVDS interfaces support display applications

• XGMII

 Density And Package Options

• 5k to 40k LUT4s, 86 to 540 I/Os

• csBGA, TQFP, PQFP, ftBGA and fpBGA packages

• Density migration supported

 Flexible Device Configuration

• SPI (master and slave) Boot Flash Interface

• Dual Boot Image supported

• Soft Error Detect (SED) macro embedded

 System Level Support

• IEEE 1149.1 and IEEE 1532 Compliant

• On-chip oscillator for initialization & general use

• Devices operate with 1.2V power supply


逻辑元件数量

17000

逻辑数组块数量——LAB

2125

工作电源电压

1.2 V

分布式RAM

35 kbit

工作温度

0 ℃

工作温度

85 ℃