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LCMXO3LF-4300C-5BG256I
FPGA - 现场可编程门阵列 4320 LUTs
Introduction LCMXO3LF-4300C-5BG256I
MachXO3™ device family is an Ultra-Low Density
family that supports the most advanced programmable
bridging and I/O expansion. It has the breakthrough
I/O density and the lowest cost per I/O. The device I/O
features have the integrated support for latest industry
standard I/O.
Features LCMXO3LF-4300C-5BG256I
1.1.1. Solutions
Smallest footprint, lowest power, high data
throughput bridging solutions for mobile
applications
Optimized footprint, logic density, I/O count, I/O
performance devices for I/O management and
logic applications
High I/O logic, lowest cost I/O, high I/O devices for
I/O expansion applications
1.1.2. Flexible Architecture LCMXO3LF-4300C-5BG256I
Logic Density ranging from 64 to 9.4K LUT4
High I/O to LUT ratio with up to 384 I/O pins
1.1.3. Advanced Packaging
0.4 mm pitch: 1K to 4K densities in very small
footprint WLCSP (2.5 mm × 2.5 mm to 3.8 mm ×
3.8 mm) with 28 to 63 I/Os
0.5 mm pitch: 640 to 9.4K LUT densities in 6 mm x
6 mm to 10 mm x 10 mm BGA packages with up to
281 I/Os
0.8 mm pitch: 1K to 9.4K densities with up to 384
I/Os in BGA packages
1.1.4. Pre-Engineered Source Synchronous I/O
DDR registers in I/O cells
Dedicated gearing logic
7:1 Gearing for Display I/Os
Generic DDR, DDRx2, DDRx4
: 900 Mb/s
: 34 kbit
: 8.45 mA
: 2.5 V/3.3 V
: - 40 ℃
: + 100 ℃