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K4B4G0446D-BYH9 原装 LPDDR3
DRAM Chip DDR3L SDRAM 4Gbit 1Gx4 1.35V
4Gb D-die DDR3L SDRAM 78FBGA with Lead-Free & Halogen-Free (RoHS compliant)
K4B4G0446D-BYH9 原装 LPDDR3 的描述:
The 4Gb DDR3 SDRAM D-die is organized as a 128Mbit x 4 I/Os x 8banks, 64Mbit x 8 I/Os x 8banks device. This synchronous device achieves high speed double-data-rate transfer rates of up to 1866Mb/sec/pin (DDR3- 1866) for general applications.
The chip is designed to comply with the following key DDR3 SDRAM features such as posted CAS, Programmable CWL, Internal (Self) Calibration, On Die Termination using ODT pin and Asynchronous Reset .
All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the crosspoint of differential clocks (CK rising and CK falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and DQS) in a source synchronous fashion. The address bus is used to convey row, column, and bank address information in a RAS/CAS multiplexing style.
The DDR3 device operates with a single 1.35V(1.28V~1.45V) & 1.5V(1.425V~1.575V) power supply and 1.35V(1.28V~1.45V) & 1.5V(1.425V~1.575V) VDDQ. The 4Gb DDR3 D-die device is available in 78ball FBGAs(x4/x8)
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MT29F64G08CBABBWPR:B
KLMBG2JETD-B041
KLMAG1JETD-B041
KLM8G1GETF-B041
KLM4G1FETE-B041
K4E8E324EB-EGCF
K4E6E304EB-EGCF
K4E6E304EC-EGCG
K4B4G1646E-BCNB
K4A8G165WB-BCRC
K4B4G0446D-BYH9
K4B4G0446D-BYH9
SAMSUNG/三星
FBGA
21+/22+
无铅/环保