Alpha RF 800T flux is formulated to be applied with foam, wave, spray and mist fluxers. Flux deposition, density and uniformity are critical to successful use of low solids no-clean flux. Applying RF 800T to a dry flux coating density of 100 to 300 micrograms per square centimetre is recommended. Preheating the circuit *embly will partially dry the flux, enhance oxide removal and promote optimum wicking, as well as superior solder joint formation. Degree of preheat is dependent on many variables; such as conveyor speed, t*e of components and substrates. Entering the solder wave with a *-side temperature of 90°C to 110°C and a bottom-side temperature of 120°C to 155°C is t*ical.
应用： RF800T松脂助焊剂的涂敷可用发泡、波峰、喷雾和雾化形式。助焊剂涂层的密度和均匀性，对免洗助焊剂成功地被应用是具关键性的影响。建议用密度为500到1500微克/平方英寸干的助焊剂涂层。预热使线路板上的助焊剂干燥，增强去除氧化物及优良焊点的形成。预热温度取决于各种因素，比如传送带速度、器件和基板的种类，进入波峰焊时，典型的顶面温度是88-150摄氏度，底面温度是121-163摄氏度。
