四层PCB电路板生产

四层：
板厚: 0.4mm/0.6mm/0.8mm/1.0mm/1.2mm/1.6mm/2.0mm
线宽/线间距: 3/3mil(0.075/0.075mm)
最小钻孔孔径: 10mil(0.25mm)
外层环宽: 4mil(0.1mm)
内层环宽: 5mil(0.127mm)
板边: 23.5mil(0.6mm)半金属化孔
BGA焊盘/焊盘间间距: 8mil(0.2mm)/19mil(0.48mm)
阻焊桥: 3mil(0.075mm)