手机BTB连接器,Borad to Board，0.4P 1.5H BTB 母座,Female BT

24PIN BTB母座0.4PITCH 1.5H

Notes:
 1.Material:
   Housing: High temperature thermoplastic,
            UL94V_0,Color, Black.
   Contact: Copper alloys.
 2.Plating:
   Underplate: Nickel.
   Contact area: Gold over nickel.
   Solder area: Tin over nickel.
3.Electrical characteristics
  Contact resistance: 50 Milliohms MAX.
  Insulation resistance: 1,00 Megohms MIN.
  Dielectric withstanding voltage: 150V AC MIN for
  1 MINUTE
4.Mechanical characteristics
  Mating force:150Kgf MAX.Unmating force: 15kgf
  MIN
  Durability: 50 Cycles
  Prodcut complied with ROHS