手机连接器，数码连接器，全塑型TF卡卡座

2.0H 全塑型TF卡座,使用于手机，数码产品

Notes:
 1.Material:
   Housing: High temperature thermoplastic,
            UL94V_0,Color, Black.

  Contact: Copper alloys.
 2.Plating:
   Underplate: Nickel.
   Contact area: Gold over nickel.
   Solder area: Tin over nickel.
3.Electrical characteristics
  Contact resistance: 80 Milliohms MAX.
  Insulation resistance: 1,000 Megohms MIN.
  Dielectric withstanding voltage: 500V AC MIN for
  1 MINUTE
4.Mechanical characteristics
  Retention force:MIN 100gf/PIN
  Durability: 1,000 Cycles
  Prodcut complied with ROHS