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单组份,导热系数25W/mK,适合3-5W大功率LED和模组。自动点胶机适用。
Introduction
Die Attach Paste ”KEMITITE *285” is epoxy resin based and solvent free T*e paste.
The highest thermal conductivity (25W/mK)
Good reflow performance due lower moisture absorption resin system.
*285 is effectively used for power IC, transistor.
Features
1) Good workability for dispensing due to solvent free and one liquid t*e paste.
2) Highest thermal conductivity(25W/mK)
3) Bleed less.
General Property
Properties
Unit
T*ical Value
Test Method
Appearance
–
Silver Filled Paste
Visual
Viscosity at 25CPa·s100EHD Viscometer 0.5rpm3°cone)
Thixotropic Index
–6.0 0.5rpm/2.5rpm
Non Voletile
Wt%92.0 180C×2hr
Silver Content
Wt%87.5 600C×3hr
Adhesive Strength
25c300CN3020
Frame: Cu/PPF
Chip Size: 2×2mm
Volume Resistivity
Ohm.cm
8×10-6
Cure: 200C×90min
Measurement: Room Temp
Gl* Transition Temperature
C200TMA
Modulus(25C)
25CGPa16.5DMA
260C 7.8
*E
Alpha 1Ppm75TMA
Alpha 2
200
Ionic Impurity
Nappm61
Atomic Absorption
Ionchromatography
CIThermal Conductivity
W/m K25
Laser Flash
4. Standard Cure Condition
175C×60-90min
5. Remarks
Storage condition is _30 to _15C 6 month
*285
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