BGA测试座/BGA原型贴片测试插座

地区:广东 深圳
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深圳市菱美电子有限公司

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https://www.lingmei.com.cn/E-TEC.htm

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Over View
  • Twist lock sockets are available for any chip size and grid pattern.

  • Available in SMT, thru-hole and solderless compression t*e versions.

  • Compact design.

  • Custom versions available on request.

    Twist-Lock T*e BGA Socket Data Sheet



 

MECHANICAL DATA

Contact life:

10,000 cycles min.

Retention System life:

1,000 cycles min.

Solderability :

Exceeds MIL-STD-202 Method 208

Individual contact force:

40 grams max.

Max. torque for retention
screws:

up to 800 pins = 7cNm or 10 oz-inch
as of 800 pins = 7cNm to 10cNm or 10 oz to 14 oz-inch

MATERIAL

Insulator (RoHS Compliant):

High temp plastic or epoxy FR4

Terminal (RoHS compliant):

Br*

Contact (RoHS compliant):

BeCu

ELE*RICAL DATA

Contact resistance:

< 100 mΩ

Current rating:

500 mA max.

Insulation resistance:

at 500V DC  100 MΩ if 0.50 to 0.80mm pitch
                  500 MΩ 1.00mm pitch upwards

Breakdown voltage:

 at 60 Hz   500V min.

Capacitance:

< 1 pF

Inductance:

< 2 nH

Operating temperature:

-55°C to +125°C ; 260°C for 60 sec.

型号/规格

BGA测试座

品牌/商标

E-TEC