| Over View |
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Solderless compression t*e sockets are available for any chip size and grid pattern.
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Easily mounted to the PCB with 4 through hole mounting pegs.
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The *embly board ensures * coplanarity of the socket.
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Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads.
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Solderless compression t*e sockets are generally supplied with a screw lock retention system.
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Custom versions available.
 Solderless/Compression T*e BGA Socket Data Sheet
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MECHANICAL DATA |
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Contact life: |
10,000 cycles min. |
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Retention System life: |
10,000 cycles min. |
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Solderability: |
exceeds MIL-STD-202 Method 208 |
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Individual contact force: |
40 grams max. | |
| MATERIAL |
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Insulator (RoHS Compliant): |
High temp plastic or epoxy FR4 |
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Terminal (RoHS compliant): |
Br* |
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Contact (RoHS compliant): |
BeCu | |
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ELE*RICAL DATA |
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Contact resistance: |
< 100 mΩ |
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Current rating: |
500 mA max. |
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Insulation resistance
at 500V DC: |
100 MΩ if 0.50 to 0.80mm pitch
500 MΩ 1.00mm pitch upwards |
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Breakdown voltage
at 60 Hz: |
500V min. |
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Capacitance: |
< 1 pF |
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Inductance: |
< 2 nH |
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Operating temperature: |
-55°C to +125°C ; 260°C for 60 sec. | |
