SGS ROHS打猎相机940nm红外灯近红外发射二*管

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Features



















?High reliability

?High radiant intensity

?Peak wavelength λp=850nm

?2.54mm Lead spacing

?Low forward voltage

?The product itself will remain within RoHS compliant version.

Descriptions

?Xinghui’s Infrared Emitting Diode is a high reliability diode , molded in a water clear plastic package.

?The device is spectrally matched with phototransistor , photodiode and infrared receiver module.

Applications

?Free air tran*ission system

?Opto electronic switch

?Infrared applied system

?Smoke detector

 

Device Selection Guide

LED Part No.

Chip Material

Lens Color

EDIRP5122C2

GaAlAs

Water clear

Package Dimensions

 

*Lead spacing is measured where the lead emerges from the package.

*Protruded resin under flange is 1.5mm Max.

 

Absolute Maximum Ratings (Ta=25)

Parameter

Symbol

Rating

Unit

Continuous Forward Current

IF

60

mA

Peak Forward Current

IFP

1

A

Reverse Voltage

VR

5

V

Operating Temperature

Topr

-40 ~ 85

Storage Temperature

Tstg

-40 ~ 85

Soldering Temperature

Tsol

260

Power Dissipation at25℃Free Air Temperature

Pd

80

mW

Notes:

  1. IFPConditions--Pulse Width≦100μs and Duty≦1%.
  2. Soldering time≦5 seconds.

 

Electro-Optical Characteristics (Ta=25)

Parameter

Symbol

Condition

Min

T*

Max

Unit

Radiant Intensity

IE

IF=20mA

7.8

15

--

mW/sr

Radiant Intensity

IE

IF=100mA

--

60

--

mW/sr

Radiant Intensity

IE

IF=1A

Pulse Width100μs ,Duty1%

--

950

--

mW/sr

Peak Wavelength

λp

IF=20mA

--

850

--

nm

Spectrial Bandwidth

Δλ

IF=20mA

--

45

--

nm

Forward

VF

IF=20mA

 

1.45

1.65

V

Forward

VF

IF=100mA

--

1.8

2.40

V

Forward Voltage

VF

IF=1A

Pulse Width100μs ,Duty1%

--

4.1

5.25

V

Reverse Current

IR

VR=5V

--

--

5

μA

View Angle

2θ1/2

IF=20mA

--

60

--

deg

 

 

 

 

 

 

 

T*ical Electro-Optical Characteristics Curves

 

 

T*ical Electro-Optical Characteristics Curves

 

 

Packing Quantity Specification

  1. 1000PCS/Bag

Instructions

1. Lead Forming

a)       During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.

b)       Lead forming should be done before soldering.

c)       Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs.

d)      Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs.

e)       When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.

 

2. Storage

a)       The LEDs should be stored at 30°C or less and 70%RH or less after being shipped fromXinghuiand the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.

b)       Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur.

 

3. Soldering

a)       Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended.

b)       Recommended soldering conditions:

 

Hand Soldering

DIP Soldering

Temp. at tip of iron

300Max. (60W Max.)

Preheat temp.

100Max. (60 sec Max.)

Soldering time

3 sec Max.

Bathtemp. & time

260 Max., 5 sec Max

Distance

3mmMin.(From solder joint to epoxy bulb)

Distance

3mmMin. (From solder joint to epoxy bulb)

Notes

1. Above specification may be changed without notice, XingHui will reserve authority on material change for above specification.

2. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. XingHui *umes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets.

3. These specification sheets include materials protected under copyright of XingHui company. Please don’t reproduce or cause anyone to reproduce them without XingHui’s consent.

 

 

产品类型

功率二*管

是否*

品牌/商标

台湾鼎元芯片

型号/规格

SMD-252018-1R8J

材料

硅(SI),硅(SI)

封装

无色水透明环氧树脂封装

工作温度范围

温度*下40度温度80度(℃)

功耗

150MW/W

针脚数

两针脚分别长度15和10MM

批号

10#同一批次

工作电流

60MA

红爆点

无红爆点,工作时候无红点

工作电压

1.1-1.3V