优质供应光磊14MIL角度30度5MM发射二*管 监控红外灯珠

地区:广东 深圳
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Features

?High reliability

?High radiant intensity

?Peak wavelength λp=850nm

?2.54mmLead spacing

?Low forward voltage

?The product itself will remain within RoHS compliant version.

 

Descriptions

?Xinghui’s Infrared Emitting Diode is a high intensity diode , molded in a water clear plastic package.

?The device is spectrally matched with phototransistor , photodiode and infrared receiver module.

 

Applications

?Free air tran*ission system

?Opto electronic switch

?Infrared applied system

?Smoke detector

Device Selection Guide

LED Part No.

Chip Material

Lens Color

TKIRP5113*

GaAlAs

Water clear

 

Package Dimensions

 

 

Absolute Maximum Ratings (Ta=25)

Parameter

Symbol

Rating

Unit

Continuous Forward Current

IF

80

mA

Peak Forward Current

IFP

1

A

Reverse Voltage

VR

5

V

Operating Temperature

Topr

-40 ~ 85

Storage Temperature

Tstg

-40 ~ 85

Soldering Temperature

Tsol

260

Power Dissipation at25℃Free Air Temperature

Pd

150

mW

 

Notes:*1:IFPConditions--Pulse Width≦100μs and Duty≦1%.

*2:Soldering time≦5 seconds.

 

Electro-Optical Characteristics (Ta=25)

Parameter

Symbol

Condition

Min

T*

Max

Unit

Radiant Intensity

IE

IF=20mA

--

14

--

mW/sr

Radiant Intensity

IE

IF=80mA

--

60

--

mW/sr

Radiant Intensity

IE

IF=1A

Pulse Width100μs ,Duty1%

--

950

--

mW/sr

Peak Wavelength

λp

IF=20mA

--

850

--

nm

Spectrial Bandwidth

Δλ

IF=20mA

--

45

--

nm

Forward

VF

IF=20mA

 

1.45

1.60

V

Forward

VF

IF=80mA

--

1.6

--

V

Forward Voltage

VF

IF=1A

Pulse Width100μs ,Duty1%

--

4.1

5.25

V

Reverse Current

IR

VR=5V

--

--

10

μA

View Angle

2θ1/2

IF=20mA

--

45

--

deg

 

1000PCS/Bag

Instructions

1. Lead Forming

a)       During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.

b)       Lead forming should be done before soldering.

c)       Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs.

d)       Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs.

e)       When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.

 

2. Storage

a)       The LEDs should be stored at 30°C or less and 70%RH or less after being shipped fromXinghuiand the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.

b)       Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur.

 

3. Soldering

a)       Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended.

b)       Recommended soldering conditions:

 

Hand Soldering

DIP Soldering

Temp. at tip of iron

300Max. (60W Max.)

Preheat temp.

100Max. (60 sec Max.)

Soldering time

3 sec Max.

Bathtemp. & time

260 Max., 5 sec Max

Distance

3mmMin.(From solder joint to epoxy bulb)

Distance

3mmMin. (From solder joint to epoxy bulb)

 

 

Notes

1. Above specification may be changed without notice, XingHui will reserve authority on material change for above specification.

2. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. XingHui *umes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets.

3. These specification sheets include materials protected under copyright of XingHui company. Please don’t reproduce or cause anyone to reproduce them without XingHui’s consent.

 

"
产品类型

功率二*管

是否*

品牌/商标

台湾管磊芯片

型号/规格

TKIRP5113*

材料

金属和银支架

备注

安*电子产品

用途

监控红外夜视辅助光

主要参数

波长为850

加工定制