热基质 - MCPCB Thermal Clad Power LED

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制造商: Bergquist Company

产品种类: 热基质 - MCPCB

RoHS:  详细信息  

配置: Star Array

设计目的: Osram Golden Dragon

热基质 - MCPCB Thermal Clad Power LED

芯体材料: Aluminum  

封装: Bulk  

系列: LED IMS  

商标: Bergquist Company  

产品类型: Thermal Substrates  

工厂包装数量: 20  

子类别: Thermal Management  

热基质 - MCPCB Thermal Clad Power LED

导热性: 1.3 W/m-K  

商标名: TCLAD  

零件号别名: 062-AL-3MP-5052 2165657

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Additional Resources:

LEDs - Temperature Effects

T-Clad Optimal Design White Paper

Bergquist Thermal Clad® Power LED IMS Substrates

Bergquist Thermal Clad® is a family of thermally conductive insulated metal substrate (IMS) circuit boards designed to replace conventional FR4 PCBs in LED applications. Designing with Power LEDs is easier with Bergquist IMS Substrates in standard configurations for the most popular LED profiles. They offer better thermal management, allowing more forward current while keeping the desired die temperatures. Thermal Clad® IMS star or square Substrates from Bergquist are available in single, strip, or array configurations with 10 different LED footprints.

Features

热基质 - MCPCB Thermal Clad Power LED

Circuit layer - 35μm (1 oz.) copper circuit foil

Dielectric layer - .076mm (3 mil) MP

Base plate - Aluminum 5052 1.57mm (0.062")

Surface Finish - White solder mask,

Pb-free HASL solder pads (RoHS compliant)