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制造商: Bergquist Company
产品种类: 热基质 - MCPCB
热基质 - MCPCB Thermal Clad Power LED
RoHS: 详细信息
配置: Star Board
设计目的: Cree XP-E
芯体材料: Aluminum
系列: LED IMS
商标: Bergquist Company
: Thermal Substrates
工厂包装数量: 500
子类别: Thermal Management
导热性: 1.3 W/m-K
商标名: TCLAD
零件号别名: 062-AL-3MP-1-6061-1L 2188494
Bergquist Thermal Clad® Power LED IMS Substrates
Bergquist Thermal Clad® is a family of thermally conductive insulated metal substrate (IMS) circuit boards designed to replace conventional FR4 PCBs in LED applications. Designing with Power LEDs is easier with Bergquist IMS Substrates in standard configurations for the most popular LED profiles. They offer better thermal management, allowing more forward current while keeping the desired die temperatures. Thermal Clad® IMS star or square Substrates from Bergquist are available in single, strip, or array configurations with 10 different LED footprints.
Features
热基质 - MCPCB Thermal Clad Power LED
Circuit layer - 35μm (1 oz.) copper circuit foil
Dielectric layer - .076mm (3 mil) MP
Base plate - Aluminum 5052 1.57mm (0.062")
Surface Finish - White solder mask,
Pb-free HASL solder pads (RoHS compliant)
951-804090
MAXIM(美信)
热基质 - MCPCB
Thermal Management
Thermal Substrates
Bergquist Company
热基质 - MCPCB Thermal Clad Power LED
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