供应K4A8G165WB-BCRC 全新原装 DDR4

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供应K4A8G165WB-BCRC 全新原装 DDR4

类别

同步动态存储器

制造商

SAMSUNG Technology Inc.

封装

96 FBGA

存储容量

8Gb512M x16)

速率

2400 Mbps

工作电压

1.2V

工作温度

0°C ~ 85°C

 

RoHS标准

RoHS Compliant

The DDR4 SDRAM is a high-speed dynamic random-access memory internally configured as sixteen-banks, 4 bank group with 4 banks for each bank group for x4/x8 and eight-banks, 2 bank group with 4 banks for each bankgroup for x16 DRAM.

The DDR4 SDRAM uses a 8n prefetch architecture to achieve high-speed operation. The 8n prefetch architecture is combined with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write operation for the DDR4 SDRAM consists of a single 8n-bit wide, four clock data transfer at the internal DRAM core and eight corresponding n-bit wide, one-half clock cycle data transfers at the I/O pins.

Read and write operation to the DDR4 SDRAM are burst oriented, start at a selected location, and continue for a burst length of eight or a choppedburst of four in a programmed sequence. Operation begins with the registration of an ACTIVATE Command, which is then followed by a Read or Write command. The address bits registered coincident with the ACTIVATE Command are used to select the bank and row to be activated 
(BG0-BG1 in x4/8 and BG0 in x16 select the bankgroup; BA0-BA1 select the bank; A0-A17 select the row; refer to DDR4 SDRAM Addressingon

Section 2.7 for specific requirements). The address bits registered coincident with the Read or Write command are used to select the starting column location for the burst operation, determine if the auto precharge command is to be issued (via A10), and select BC4 or BL8 mode on the fly(via A12) if enabled in the mode register.

型号

K4A8G165WB-BCRC

制造商

SAMSUNG

批次

23+

封装

96 FBGA

电压-供电

1.2V