原装 K4E6E304EC-EGCG LPDDR3

原装 K4E6E304EC-EGCG LPDDR3

16Gb DDP LPDDR3 SDRAM 512M x32 (32M x32 x 8banks) 178FBGA, 11x11.5

原装 K4E6E304EC-EGCG LPDDR3 的封装图

原装 K4E6E304EC-EGCG LPDDR3 的技术参数:

制造商 ：SAMSUNG

电压 ： 1.8 / 1.2 / 1.2 V

组织：512M*32

温度规格 ：-25°C~+85°C

速度 ：2133Mbps

存储格式 ：DRAM

安装类型 ：表面贴装

容量 ：16G

封装 ：FBGA-178

原装 K4E6E304EC-EGCG LPDDR3 的 特征：

• Double-data rate architecture; two data transfers per clock cycle

• Bidirectional data strobes (DQS_t, DQS_c), These are transmitted/received with data to be used in capturing data at the receiver

• Differential clock inputs (CK_t and CK_c)

• Differential data strobes (DQS_t and DQS_c)

• Commands & addresses entered on both positive and negative CK edges; data and data mask referenced to both edges of DQS

• 8 internal banks for concurrent operation

• Data mask (DM) for write data

• Burst Length: 8

• Burst Type: Sequential

• Read & Write latency : Refer to Table 45 LPDDR3 AC Timing Table

• Auto Precharge option for each burst access

• Configurable Drive Strength

• All Bank Refresh, Per Bank Refresh and Self Refresh

• Partial Array Self Refresh and Temperature Compensated Self Refresh

• Write Leveling

• CA Calibration

• HSUL_12 compatible inputs

• VDD1/VDD2/VDDQ/VDDCA: 1.8V/1.2V/1.2V / 1.2V

• No DLL : CK to DQS is not synchronized

• Edge aligned data output, center aligned data input

• Operating Temperature : -25 ~ 85°C

• On Die Termination using ODT pin\

• 2/CS, 2CKE

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