原装KMGX6001BA-B514T09多制层封装芯片

原装KMGX6001BA-B514T09多制层封装芯片

制造商  -     SAMSUNG

封装  -    FBGA-221

存储类型  -    EMCP

描述  -    多芯片封装存储器

eStorage 密度  -    32GB

DRAM 密度  -    24Gb

速率  -    1866Mbps

封装  -    221FBGA

Equip mobile devices for the age of AI and 5G. DRAM and NAND come together in a single compact package to deliver flagship-level performance. LPDDR5 uMCP brings high-bandwidth storage and memory, crucial for the increasingly data-heavy demands of smartphones, wearables, and AI technology. Take less space and offer capabilities for the ever-growing 5G world.

全新原包原装可含税（香港可交）

KMGX6001BA-B514

KMGP6001BA-B514

KMFN60012M-B214

KMDX60018M-B425

KLMDG8JENB-B041

KLMCG4JETD-B041

KLMBG2JETD-B041

KLMAG1JETD-B041

KLM8G1GETF-B041

KLM4G1FETE-B041

K9F1G08U0E-SIB0

K4Z80325BC-HC14

K4G80325FC-HC25

K4E8E324ED-EGCG

K4E8E324EB-EGCF

K4E6E304EB-EGCF

K4E6E304ED-EGCG

K4E6E304EC-EGCG

K4E6E304EC-EGCF