供应苹果NANO SIM卡座

外形尺寸：16.5mm*15.9mm*1.5mm   

參數配置 ：nano-SIM-Card   

1.MATERIAL 　　Insulator:High Temperature Thermoplastic 　　UL94V-O 　　Contact:Copper Alloy 　　Shell:Copper Alloy   

2.PLATING 　　Contact Area:Gold PLATED Over Ni. 　　Solder Tail:Sn PLATED Over Ni. 　　Shell Solder Arda:Gold PLATED Over Ni. 

3.ELECTRICAL 　　Operating Temperature:-25℃ TO+90℃ 　　Current Rating:0.5mA max. 　　Contact Resist

ance:100mΩ max. 　　Insulation Resistance:1000MΩ min./500VDC