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外形尺寸:16.3mm*14.6mm*1.8mm
参数配置 :鉸鏈型MICRO-SIM卡座 1.MATERIAL
Insulator:High Temperature Thermoplastic,
UL94V-O Contact:Copper Alloy
Shell:Copper Alloy 2.PLATING
Contact Area:Gold PLATED Over Ni.
Solder Tail:Sn PLATED Over Ni.
Shell Solder Arda:Gold PLATED Over Ni. 3.ELECTRICAL
Operating Temperature:-25℃TO+90℃
Current Rating:0.5mA max.
Contact Resistance:100mΩ max.
Insulation Resistance:1000MΩ min./500VDC
SMO-1512
硕方
16.3mm*14.6mm*1.8mm
鉸鏈型MICRO-SIM卡座
-25℃TO+90℃
1000MΩ min./500VDC