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外形尺寸:13.6mm*13.4mm 參數配置 :MICRO-SIM連接器:Push-Pull 1.MATERIAL Insulator:High Temperature Thermoplastic UL94V-O Contact:Copper Alloy Shell:Copper Alloy 2.PLATING Contact Area:Gold PLATED Over Ni. Solder Tail:Sn PLATED Over Ni. Shell Solder Arda:Gold PLATED Over Ni. 3.ELECTRICAL Operating Temperature:-25℃ TO+90℃ Current Rating:0.5mA max. Contact Resistance:100mΩ max. Insulation Resistance:1000MΩ min./500VDC
13.6mm*13.4mm
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SIM
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