风华 0201CG3R9C250NT 贴片电容

风华

将电容在 80~120℃的温度下预热 10~30 秒.

Preheating conditions:80 to 120℃; 10~30s.

可焊性

Solderability

上锡率应大于 95%

外观：无可见损伤.

At least 95% of the terminal electrode is

covered by new solder.

Visual Appearance: No visible damage.

有铅焊料：（Sn/Pb：63/37）

浸锡温度: 235±5℃

浸锡时间: 2±0.5s

Solder Temperature: 235±5℃

Duration: 2±0.5s

无铅焊料：

浸锡温度: 245±5℃

浸锡时间: 2±0.5s

Solder Temperature: 245±5℃

Duration: 2±0.5s

项目

Item

NPO至 SL

NPO to SL

X7R/X5R/

X7S/X6S

Y5V、

Z5U

ΔC/C

≤ ± 0.5% 或 ±

0.5PF，取较大值

≤±0.5% or ±0.5PF，

whichever is larger

-5~+10%

-10~+2

0%

DF 同初始标准

Same to initial value.

IR 同初始标准

Same to initial value.

耐焊接热

Resistance to

Soldering Heat

外观：无可见损伤 上锡率：≥95%

Appearance：No visible damage.At least 95% of

the terminal electrode is covered by new solder.

将电容在 100~200℃的温度下预热 10±2 分钟.

浸锡温度: 265±5℃

浸锡时间: 10±1s

然后取出溶剂清洗干净，在 10 倍以上的显微镜底

下观察.

放置时间：24±2 小时 放置条件：室温

Preheating conditions: 100 to 200℃; 10±2min.

Solder Temperature: 265±5℃

Duration: 10±1s

Clean the capacitor with solvent and examine it with

a 10X(min.) microscope.

Recovery Time: 24±2h

Recovery condition: Room temperature

外观：无可见损伤.

Appearance: No visible damage.

抗弯曲强度

Resistance

to Flexure

of Substrate

(Bending

Strength)

ΔC/C ≤±10%

试验基板：Al2O3或 PCB

弯曲深度：1mm

施压速度：0.5mm/sec.

单位：mm

应在弯曲状态下进行测量。

※ T=10

45±2 45±2

Test Board: Al2O3 or PCB

Warp: 1mm

Speed: 0.5mm/sec.

Unit: mm

The measurement should be