DDR存储MT46V128M8P-6T IT:A

MT46V128M8P-6T IT:A  MT46V128M8P-6T IT:A  MT46V128M8P-6T IT:A  MT46V128M8P-6T IT:A

Features

• V DD = 2.5V ±0.2V, V DD Q = 2.5V ±0.2V

V DD = 2.6V ±0.1V, V DD Q = 2.6V ±0.1V (DDR400)

• Bidirectional data strobe (DQS) transmitted/

received with data, that is, source-synchronous data

capture (x16 has two – one per byte)

• Internal, pipelined double-data-rate (DDR)

architecture; two data accesses per clock cycle

• Differential clock inputs (CK and CK#)

• Commands entered on each positive CK edge

• DQS edge-aligned with data for READs; center-

aligned with data for WRITEs

• DLL to align DQ and DQS transitions with CK

• Four internal banks for concurrent operation

• Data mask (DM) for masking write data

(x16 has two – one per byte)

• Programmable burst lengths (BL): 2, 4, or 8

• Auto refresh and self refresh modes

• Longer-lead TSOP for improved reliability (OCPL)

• 2.5V I/O (SSTL_2 compatible)

• Concurrent auto precharge option is supported

•

t RAS lockout supported ( t RAP =  t RCD)

Notes: 1. Not recommended for new designs.

2. See Table 3 on page 2 for module

compatibility.

Options Marking

• Configuration

– 256 Meg x 4 (64 Meg x 4 x 4 banks) 256M4

– 128 Meg x 8 (32 Meg x 8 x 4 banks) 128M8

– 64 Meg x 16 (16 Meg x 16 x 4 banks) 64M16

• Plastic package – OCPL

– 66-pin TSOP

(400-mil width, 0.65mm pin pitch)

TG

– 66-pin TSOP (Pb-free)

(400-mil width, 0.65mm pin pitch)

P

• Timing – cycle time

– 5.0ns @ CL = 3 (DDR400B) -5B 1

– 6.0ns @ CL = 2.5 (DDR333B) 2 -6T

– 7.5ns @ CL = 2.5 (DDR266B) 2 -75

• Temperature rating

– Commercial (0?C to +70?C) None

– Industrial (–40°C to +85°C)  IT

• Revision :A