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特性:
Designed for high speed tran*ission of 2.7Gbps or more.
With various simulations on a latest simulation tool, ideal impedance matching of the inside signal of a connector and GND Path has been achieved.
The whole connector is covered by metal shell. Furthermore, it’s shortest certain GND route by the multiple points of ground contact can perform the excellent EMI characteristic.
Double locking structure is available, the standard built-in lock and optional pull bar locking, allow easy and certain operation.
Receptacle: Secure highly reliable contact structure of the W-point contact under severe environments.
Receptacle: Over-molding design under the connector can bring the benefit of minimum Pattern prohibition areas and the design flexibility of board wiring and VIA hole.
Electrically characteristic (for horizontal matching co-axial connector)
Pitch: 0.4mm
Height: 1.0mm
DVI
磷铜
WAFER
是
条形
显示屏
I-PEX 20455-030E
高频
阻火/阻燃
LCP
I-PEX
单卡
IC
冷压