Features
•package: white SMD package, colorless clear silicone resin, clear silicone lens, chip level conversion
•t*ical Luminous Flux: 79 lm at 350 mA up to 178 lm at 1 A (3500 K)
•feature of the device: high efficient lightsource at low space
•color temperature: 2500 K to 4800 K
•color reproduction index: 80
•viewing angle: 170°
•technology: ThinGaN
•optical efficiency: 68 lm/W at 3500 K
•grouping parameter: luminous flux, color coordinates
•*embly methods: suitable for all SMT *embly methods
•soldering methods: reflow soldering
•preconditioning: acc. to JEDEC Level 4
•taping: 24 mm tape with 200/reel, ø180 mm
•*D-withstand voltage: up to 2 kV acc. to J*D22-A114-D
