QSFP+ mating part，38针 0.38µm (15µ"
地区：广东 东莞
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连接方式: QSFP Connector
说明:0.80mm (.031") Pitch, iP*™ I/O SMT Receptacle, Right Angle, External Application, 38 Circuit, 0.38µm (15µ") Gold (Au)
| Boot Color | N/A |
| Circuits (Loaded) | 38 |
| Circuits (maximum) | 38 |
| Color - Resin | Black |
| Durability (mating cycles max) | 50 |
| Flammability | 94V-0 |
| Gender | Female |
| Keying to Mating Part | None |
| Lock to Mating Part | None |
| Material - Metal | High Performance Alloy (HPA) |
| Material - Plating Mating | Gold |
| Material - Plating Termination | Tin |
| Material - Resin | High Temperature Thermoplastic |
| Number of Rows | 2 |
| Orientation | Right Angle |
| PCB Locator | Yes |
| PCB Retention | None |
| PCB Thickness - Recommended | 1.35mm (.053") |
| Packaging T*e | Embossed Tape on Reel |
| Panel Mount | No |
| Pitch - Mating Interface | 0.80mm (.031") |
| Pitch - Termination Interface | 0.80mm (.031") |
| Plating min - Mating | 0.381µm (15µ") |
| Plating min - Termination | 2.540µm (100µ") |
| Polarized to Mating Part | Yes |
| Polarized to PCB | Yes |
| Ports | 1 |
| Surface Mount Compatible (SMC) | Yes |
| Temperature Range - Operating | -40°C to 80°C |
| Termination Interface: Style | Surface Mount |
| Waterproof / Dustproof | No |
| Wire Insulation Diameter | N/A |
| Wire Size AWG | N/A
|
