供应molex连接器
地区：北京
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产品属性
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| Product Family | PCB Receptacles |
| Series | 75005 |
| Application | Board-to-Board |
| Product Name | Plateau HS Mezz™ |
| Circuits (Loaded) | 48 |
| Color - Resin | Black |
| Durability (mating cycles max) | 25 |
| Flammability | 94V-0 |
| Glow-Wire Compliant | No |
| Material - Metal | High Performance Alloy (HPA) |
| Material - Plating Mating | Gold |
| Material - Plating Termination | Tin |
| Material - Resin | High Temperature Thermoplastic |
| Number of Rows | 2 |
| Orientation | Vertical |
| PCB Locator | Yes |
| PCB Retention | Yes |
| PCB Thickness Recommended (in) | 0.062 In |
| PCB Thickness Recommended (mm) | 1.60 mm |
| Packaging T*e | Embossed Tape on Reel |
| Pitch - Mating Interface (in) | 0.047 In, 0.138 In |
| Pitch - Mating Interface (mm) | 1.20 mm, 3.51 mm |
| Plating min: Mating (µin) | 30.4 |
| Plating min: Mating (µm) | 0.76 |
| Plating min: Termination (µin) | 152.4 |
| Plating min: Termination (µm) | 3.81 |
| Polarized to PCB | Yes |
| Surface Mount Compatible (SMC) | N/A |
| Temperature Range - Operating | -20°C to 85°C |
| Termination Interface: Style | Surface Mount |
| CSA | LR19980 |
| Current - Maximum | 1.5A |
| UL | E29179 |
| Voltage - Maximum | 30V |
| Duration at Max. Process Temperature (seconds) | 40 |
| Lead-free Process Capability | Reflow Capable (SMT only) |
| Max. Cycles at Max. Process Temperature | 3 |
| Process Temperature max. C | 260 |
| Product Specification | PS-75005-001, PS-75005-002 |
| Sales Drawing | SD-75005-001 |
Molex/莫莱克斯
通讯
板对板
*
48p
