 | -Features | | ● | Board mounting height: 2.5mm, Off-set t*e: 1.6mm | | ● | The header has a vacuum mount face that enables vacuum absorption and automatic mounting by embossed tape packaging. | | ● | The header has a box structure to prevent from being twisted with * prevention from mis-insertion. Furthermore, the header has a wall on the PCB side and does not have any trouble resulting from the friction of the socket with the PCB. | | ● | A metal holddown is attached to prevent the solder peel. | | ● | High heat resistant nylon insulation material is used and allows *, IR, or hot air reflow soldering. |  |  |  | -Applications | | | Photograph_Help | LCD, Notebook PC, Portable terminals (PDA), Compact office equipment, Consumer electronics |  |  | | | | 300KB | | |
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| Characteristic | Specifications | | No. of Positions | 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, 30 | | Current Rating(Amps)(Max.) | 1 | | PCB Mount T*e | SMT | | Contact Mating Area Plating | Tin, Tinned Copper, Gold | | Terminal Pitch (mm) | 1.25 | | Contact Spacing (mm) | 1.25 | | Operating Temperature Range (degrees C) | -35 to 85 | | Termination Style | Crimping | | Connector T*e | Board mounting/Wire | | Contact Gender | Female, Male |
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