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U*3.0 A/F沉板式母座
Material:
Housing: High-Temperature thermoplastic (UL94V-0) Contact:Copper Alloy Shell:Copper Alloy* Mechanical:Insertion Force:3.6kfg max
* Electrical Specification:Current Rating:1.0 Ampere
Contact Resistance:30 Milliohms max
Insulation Resistance:1000 Megohms min
Dielectric Withstanding Voltage:500V AC
* Environmental:Operating Temperature:-25℃ to 85℃
Withdrawal Force:1.0kfg min
是
优联康
U*3.0 A/F沉板式母座
PCB
插头/插座
U*
单卡
SD
条形
冲压+ 电镀+注塑+组装
阻火/阻燃
高频
铜合金
LCP+30%GF
9
9
0(mm)