供应Molex插座头4-

SPQ2.55K HDR*OS 3MM VERT TIN

产品编号: 43650-0315
3.00mm Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg, 3 Circuits, Tin (Sn) Plating, Glow Wire Compatible

产品详细资料Collapse all
一般状态 还*
类别 PCB插座头
系列 43650
应用 Power, 线对板
注解 "High Temperature, Square Pin, Offset Through Hole Mounting, Solder T*e

This Molex product is manufactured from material that has the following ratings, tested by independent agencies:
a) A Glow Wire Ignition Temperature (GWIT) of at least 775 deg C per IEC 60695-2-13.
b) A Glow Wire Flammability Index (GWFI) above 850 deg C per IEC 60695-2-12.and hence complies with the requirements set out in the International Standard IEC 60335-1 5th edition - household and similar electrical appliances - safety, section 30 Resistance to heat and fire.

The customers using this product must determine its suitability for use in their particular application through testing or other acceptable means as described in end-product glow-wire flammability test standard IEC 60695-2-11 and any applicable product end-use standard(s).

If it is determined during the customer’s evaluation of suitability, that higher performance is required, please contact Molex for possible product options."
 
概述 Micro-Fit 3.0™ Connectors
Product Literature Order No 987650-5984
产品名称 Micro-Fit 3.0™
UPC 8

物理断开 否
电路数(已装入的) 3
电路数(*多的） 3
颜色-树脂 黑色
耐用性(插拔次数) - *多次数 30
阻燃性 94V-0
满足欧洲Glow-Wire标准 是
插配高度 17.27mm
材料-金属 黄铜
材料-接合处电镀 锡
材料-终端电镀 锡
材料-树脂 高温热塑型塑料
Net Weight 0.595/g
行数 1
方向 垂直的
PCB * 是
PCB 保持力 是
PC厚度：推荐 1.60mm
包装形式 盘状
间距-接合界面 3.00mm
*薄镀层 - 接合部位 2.540µm
*小镀层：端接 2.540µm
PCB *性 是
有护墙的 *
可堆叠的 否
穿孔式表面焊接(SMC) 是
运行温度范围 -40°C to 105°C
终端界面:类型 穿孔式：曲针式焊脚

电气(请核对产品规格的具体细节.)
每触点*大电流 5A
电压 -*大 250V

Agency CertificationCSA LR19980
TUV R
UL E29179

焊接处理数据Duration at Max. Process Temperature (seconds) 30
无铅工艺能力 SMC & 波峰焊可 (*限通孔型 )
Max. Cycles at Max. Process Temperature 3
Process Temperature max. C 260

材料信息
参考：图纸编号产品规格 PS-43650
销售用图纸 SD-43650-006