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表面贴装玻璃钝化硅整流
Reverse Voltage - 50 to 1000 V
反向电压 -50至1000 V
Forward Current - 1 A
正向电流 -1一个
Features
特点
• The plastic package carries Underwrites Laboratory
•塑料封装进行*实验室
Flammability cl*ification 94V-0
易燃性分级94V- 0
• For surface mounted application
•对于表面安装应用程序
• Gl* p*ivated junction
•对于表面安装应用程序
Mechanical Data
•玻璃钝化交界处 机械数据
• Case: MiniMELF(DO-213AA), molded plastic body
•案例:MiniMELF(DO-213AA),模压塑料车身
• Terminals: Lead solderable per MIL-STD-750,
•端子:每MIL- STD- 750无铅可焊性,
method 2026
方法2026
• Polarity: Color band denotes cathode end
•*性:色环端为负*
• Mounting Position: Any
•安装位置:任何
Maximum Ratings and Electrical characteristics
Ratings at 25 OC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
*大额定值和电气特性
在环境温度25℃,除非另有规定的评价。单相半波,60赫兹,电阻或电感性负载。
对于容性负载,减免20%的电流。
Parameter Symbols LM4001G LM4002G LM4003G LM4004G LM4005G LM4006G LM4007G Units
Maximum Recurrent Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 V
Maximum RMS Voltage VRMS 35 70 140 280 420 560 700 V
Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 V
Maximum Average Forward Rectified Current at TA = 75 OC IF(*) 1 A
Peak Forward Surge Current 8.3 ms Single Half Sine Wave
Superimposed on Rated Load (JEDEC Method) IFSM 25 A
Maximum Forward Voltage at 1 A VF 1.1 V
Maximum Reverse Current
at Rated DC Blocking Voltage
TA = 25 OC
TA = 125 OC IR 5
50 μA
T*ical Junction Capacitance 1) CJ 15 pF
T*ical Thermal Resistance 2) RθJA 75 OC/W
T*ical Thermal Resistance 3) RθJL 30 OC/W
Operating and Storage Temperature Range Tj,Tstg - 55 to + 150 OC
1) Measured at 1 MHz and applied reverse voltage of 4 V
2) Thermal resistance from junction to ambient 0.24 X 0.24" (6 X 6 mm) copper pads to each terminal
3) Thermal resistance from junction to terminal 0.24 X 0.24" (6 X 6 mm) copper pads to each terminal
参数*号LM4001G LM4002G LM4003G LM4004G LM4005G LM4006G LM4007G单位
*大的经常峰值反向电压VRRM50 100 200400 600 8001000伏
*大RMS电压VRMS的3570 140280420 560700 V的
*大直流阻断电压VDC50 100 200400 600 8001000伏
*大平均正向整流电流在TA= 75业主立案法团IF(*)1一个
峰值正向浪涌电流8.3毫秒单一正弦半波
叠加在额定载荷(JEDEC方法)IFSM25一个
*大正向电压在1的VF1.1 V
*大反向电流
额定直流阻断电压
TA =25℃
TA= 125 OC红外5
50μA
典型结电容1)CJ -15 pF的
典型的热电阻2)RθJA75 OC/ W
典型热阻3)RθJL30℃/ W
操作和存储温度范围TJ,TSTG - 55+150业主立案法团
1)在1 MHz和应用4 V的反向电压
2)热敏电阻从结点到环境0.24 X0.24“(6 × 6毫米)铜垫给每个终端
3)热电阻从路口到码头0.24 X0.24“(6 × 6毫米)铜垫,每个终端
是
整流管
否
0N/安森美
ST二*管LM4001/LM4002/LM4003/LM4004/LM4005/LM4006/LM4007
硅(Si)
ST二*管LM4001/LM4002/LM4003/LM4004/LM4005/LM4006/LM4007
开关,稳压,肖特基
ST二*管LM4001/LM4002/LM4003/LM4004/LM4005/LM4006/LM4007