大功率银胶*285

大功率LED*导电银胶，单组份，冷藏，银粉较细粒，粘接好。导热25W。产地日本（京瓷）

Die Attach Paste ”KEMITITE *285” is epoxy resin based and solvent free T*e paste.

The highest thermal conductivity (25W/mK)

Good reflow performance due lower moisture absorption resin system.

*285 is effectively used for power IC, transistor.

1） Good workability for dispensing due to solvent free and> Highest thermal conductivity(25W/mK)

3） Bleed less.

Properties			Unit	T*ical Value	Test Method
Appearance			–	Silver Filled Paste	Visual
Viscosity at 25C			Pa·s	100	EHD Viscometer 0.5rpm (3°cone)
Thixotropic Index			–	6.0	0.5rpm/2.5rpm
Non Voletile			Wt%	92.0	180C×2hr
Silver Content			Wt%	87.5	600C×3hr
Adhesive Strength		25C 300C	N	30 20	Frame: Cu/PPF Chip Size: 2×2mm
Volume Resistivity			Ohm.cm	8×10^-6	Cure: 200C×90min Measurement: Room Temp
Gl* Transition Temperature			C	200	TMA
Modulus(25C)	25C		GPa	16.5	DMA
	260C			7.8
*E	Alpha 1		Ppm	75	TMA
	Alpha 2			200
Ionic Impurity	Na		ppm	6 1	Atomic Absorption Ionchromatography
	CI
Thermal Conductivity			W/m K	25	Laser Flash

4. Standard Cure Condition

175C×60-90min

5. Remarks

Storage condition is _30 to _15C 6 month

CAUTION: Property values listed are t*ical values. The data herein is for information only.

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型号/规格

*285

品牌/商标

日本京瓷

供应大功率银胶*285