|
项 目 |
CP45F/FV NEO |
|
视别方法 |
全视觉(Fly Vision+Stage Vision) |
|
贴装速度 |
Chip |
**度 |
0.178sec/chip |
|
*9580 |
14900CPH(1608) |
|
IC |
飞行相机 |
0.75sec/QFP64 |
|
固定相机 |
1.6sec/QFP256 |
|
贴装精度 |
0603(0201)Chip |
±0.08mm |
|
1005Chip~ |
±0.1mm |
|
QFP |
±0.04mm |
|
元件尺寸 |
飞行相机 |
1005(0402)～□22mm IC,0603(0201)～□12mm (选项) |
|
标准固定相机(FOV35) |
～□32mm IC(Lead Pitch:0.4mm) |
|
*固定相机(FOV20) |
～□17mm IC(Lead Pitch:0.3mm) |
|
*固定相机(FOV45) |
～□42mm IC(Lead Pitch:0.5mm) |
|
*小.Lead Pitch(QFP) |
0.3mm(with FOV20 Vision) |
|
*小.Ball Pitch(BGA) |
0.5mm(with FOV20 Vision) |
|
部品*高 |
15mm(9mm:with flying vision) |
|
PCB板尺寸 |
460X400X4.2~50X30X0.38 / 510X460X4.2~50X100X0.38(CP45-L NEO) |
