LGA-BGA 771: pe
地区:广东 深圳
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LGA 771 leaded t*e with 30u' Au |
Feature | Attribute |
Number of Positions : | 771 |
PCB Mount Style : | lga/*t t*e |
Contact Materials : | copper alloy |
Plating : | 30u' au min |
Housing Material : | thermoplastic |
Color : | black |
Available Status : | active |
RoHS Status : | rohs-5 compliant |
Lead-free Replacement : | rohs-6 compliant |
Business Unit : | ics |
Lead-Time ( Week ) : | 1 |
MOQ ( pc ) : | 400 |
IDC
1
771
板对板
否
矩形
1(mm)
电脑
pe
低频
*潮
1
FOXCONN/富士康
单卡
1
PCMCIA
注塑