L002/白膜/黑膜/FPC/柔性线路板/软灯条/
地区：广东 江门
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| 技术参数<Technical Parameters> | ||||
| 项目 | Item | 参数<Parameter> | ||
| 单面<Single Side> | 双面<Double Side> | 多层<Multilayer> | ||
| 板材 | Base Material | XPC/FR1/22F/CEM-1/CEM-3/FR-4/柔性基板,铝基板 | CEM-3/FR-4/柔性基板,铝基板 | FR-4 |
| 板材厚度 | Board Thickness | 0.15MM-3.0MM | 0.15MM-3.0MM | 0.4MM-5.0MM |
| 层数 | Layers | 1 | 2 | 4月8日 |
| 铜箔厚度 | Copper Foil Thickness | 9-70um<标准:18um,35um,70um> | ||
| *剥强度 | Peel Strength | 1.25N/mm | 1.25N/mm | 1.25N/mm |
| *缘电阻 | Insulation Resistance | ≥10Ω常态 | ||
| *电强度 | Electric Strength | ≥1.4KV/mm | ||
| 阻燃特性 | Flame Resisant | 94HB/94VO | 94V-O | 94V-O |
| *小冲孔孔径 | Min.punch Hole Size | 0.8mm/31mil | ||
| *小钻孔孔径 | Min.drill Hole Size | 0.3mm/12mil | 0.3mm/12mil | 0.3mm/12mil |
| 孔径公差 | Hole Size Tolerance | ≤Φ0.8mm&plu*n;0.1mm | ||
| 孔位公差 | Hole location Tolerance | &plu*n;0.1mm | &plu*n;0.5mm | &plu*n;0.5mm |
| 孔壁铜厚 | PTH Wall Thickness | ≥2um/0.8mil | ≥2um/0.8mil | |
| 孔电阻 | Hole Resistance | ≤300u Ω | ≤300u Ω | |
| *小线宽 | Min.Line Width | 0.3mm/12mil | 0.15mm/6mil | 0.15mm/6mil |
| *小间距 | Min.Space | 0.3mm/12mil | 0.15mm/6mil | 0.15mm/6mil |
| 表面处理 | Surface Treatment | 松香<Colphony>,喷锡<HAL>,电金<Electroness Au>,*氧化<OSP>,化金<Chemical Au>,碳油<Carbon Print> | ||
| 翘曲度 | Bow And Twist | ≤1% | ≤1% | ≤1% |
| *小加工尺寸 | Min.Unit Area | 4mmX6mm | 4mmX6mm | 10mmX10mm |
| *大加工尺寸 | Max.Unit Area | 1200mmX500mm | 610mmX510mm | 500mmX450mm |
| 外型尺寸公差 | Profile Tolerance | &plu*n;0.15MM<Routing> | &plu*n;0.15MM<Routing> | &plu*n;0.15MM<Routing> |
| 开槽 | V-CUT | 25℃/30℃/45℃ | ||
| 阻焊硬度 | Soldermask Abrasion | ≥3H | ≥6H | ≥6H |
| 阻焊种类 | Solder Mask T*e | 液态感光阻焊油、热固化阻焊油、UV阻焊油，层压PI/PET覆盖膜 | ||
| 阻焊热冲击 | Solderability | 260℃&plu*n;5℃/10Second/3Time | ||
| 栓验标准 | QC Criterion | GB4588.2 GB4588.4 *600E *-A-600F *-ML-950 | ||
| *种类 | Pcb Files T*e | Protel,Gerber,Powerpcb,Pcad,Autocad,Orcad,Cam350,菲林,样板 | ||
