*销售*、*度FPC线路板图集

地区:广东 东莞
认证:

东莞市浩裕电子科技有限公司

普通会员

全部产品 进入商铺
品牌:HOODYU 型号:多样 机械刚性:柔性 层数:双面 基材:沉金、PP *缘材料:*树脂 *缘层厚度:薄型板 阻燃特性:VO板 加工工艺:电解箔 增强材料:玻纤布基 *缘树脂:环氧树脂(EP) 产品性质:* 营销方式:* 营销价格:*

生产能力:

生产尺寸

Working Panel Size:

*大:20.47×24.41(520mm*620mm)

Max. :20.47″×24.41″(520mm×620mm)

*小:0.98×1.06(25mm*27mm)

Min. :0.98″×1.06″(520mm×620mm)

板翘曲度:*大1.0%;*小0.5%

Bow and Twist : Max.1.0%; Min. 0.5%

压板公差:&plu*n;0.0020.051mm

Press-fit Tolerance :&plu*n;0.002″(0.051mm)

*小孔距/孔径:

Min. Drill Hole/Land

内层:4mils(0.1mm)/4mils(0.1mm)

Inner : 10mils(0.25mm)/20mils(0.50mm)

外层:4mils(0.1mm)/4mils(0.1mm)

Outer : 10mils(0.25mm)/20mils(0.5mm)

层数:2~10层

Layers Counts: 2 to 10 Layers

*小完成孔径:8mils(0.20mm/)

Min. Finished Vias :8 mils(0.20mm/finishing)

线宽/线距:

Trace / Space:

内层:4/4mils(0.10mm)

Inner Layer : 4 / 4 Mils (0.10mm)

外层:4/4mils(0.10mm)

Outer Layer :4 / 4 Mils(0.10mm)

SMT*小间距:16mils(0.4mm)

Min. SMT Pitch : 16 Mils (0.4mm)

*小绿油桥:3.0mils(0.076mm)

Min. Solder-mask bridge :3.0 mils(0.076mm)

*小开窗:1.5mils(0.04mm)

Min. Solder-mask opening : 1.5 mils(0.04mm)

板厚:16~157mils(0.4~4.0mm)

Board Thickness : 16~157mils(0.4-4.0mm)

*小孔径:8mils(0.20mm)

Min.. Vias : 8 mils(0.20mm)

孔径纵横比:61

Aspect Ratio : 6:1

干膜*孔能力:6mils(0.15mm)

Dry Film Sealing Capacity : 6mils(0.15mm)

孔位偏差:&plu*n;2mils(0.051mm)

Hole Position deflection :&plu*n;2mils(0.051mm)

表面处理:

Finish Process (out of KG)

喷锡;非ROHS要求

HASL : Not ROHS requirement

沉银、沉锡:*合ROHS要求

Immersion Silver, Immersion Tin : ROHS compatible

镀金、沉金:*合ROHS要求

Flash Gold Plating, Immersion Gold : ROHS compatible

铳金手指、*氧化:*合ROHS要求

Finger Plating, ENTEK : ROHS compatible

无锡喷锡:*合ROHS要求

Lead Free HASL : ROHS compatible