Mini U* 5P Female AB T*e SMT 沉板反向 长7.70.jpg

*TE:
1)Electrical:
 1.1 Contact Resistance: 30M? Max
 1.2 Insulation Resistance:100M? Min
 1.3 Withstanding VOltage :500V DC
 1.4 Current rating 1.0AMP Max
 
2)Material:
  2.1. Housing:LCP
  2.2.Contact:PhosphorBronze(Cu5191-EH
      T=0.25)
  2.3.ConnneectorShell:Br*(Cu2680-H
      T=0.40)

 3)Finishing:
 3.1 Contact Area PLated:Gold 1-30U″
     Over Nickel 50U″
 3.2 Solder Area PLated :Tin 80U″Min
 3.3 Connneector Shell PLating:Nickel
     80U″PLated Over Cu 50U″