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(Specifications)技术参数:
Model 型 号 | FL-V3L | |||
Inspectable Board | PCB T*e 基板种类 | Post Printing 印刷后 | Post Mounting 贴装后 | Post reflow 焊接后 |
检查对象基板 | PCB Size 基板尺寸 | Min.50mm(L)×50mm(W) Max.400mm(L)×420mm(W) | ||
PCB Thickness | 基板厚度 | 0.3—3.0mm | ||
PCB Warpage | 基板扭曲度 | <1﹪(diagonally)对角测量 | ||
Maximum Component Height | 上下净高 | Top Side: 20mm(Optional: 40mm) Bottom Side: 50mm | ||
基板上: 20mm(可选: 40mm) 基板下: 50mm | ||||
PCB Fixing Method | 基板固定方式 | Side Clamping 外形固定 | ||
Defects Detected | 检查项目 | Solder availability | Component misalignment, | Missing component wrong |
solder misalignment | Opposite polarity, | component solder misalignment | ||
excessive solder | Missing component, | insufficient solder,solder bridging, | ||
insufficient solder | Damaged component | excessive solder,cold soldering, | ||
solder bridging | Wrong component | open soldering solder ball,lifted | ||
有无焊锡、焊锡偏移、 | 元件偏移、*性、缺件、 | lead,opposite polarity | ||
焊锡过多、焊锡过少、 | 元件破损、元件错装 | 缺件、错件、偏移、少锡、连锡 | ||
桥接 | (立碑、反白、测立) | 多锡、空焊、假焊、锡球、翘脚 | ||
*性反 | ||||
Inspection Range | 检查个数 | Max.10,000components/PCB *大10,000元件/基板 | ||
Data save | 数据保存 | Hard Disc 硬盘 | ||
Component library | 元件库检查 | Component cl*ification/data base/template | ||
元件分类/元件资料库/元件模板 | ||||
Inspection time | 标准检查时间 | 4—15ms/元件(4—15ms/component,<150ms/FOV) | ||
Results display | 输出检查结果 | PCB ID,PCB Description,Component Description,defect Description,PCB Abbr.Diagram | ||
基板ID、基板名称、元件名称、不良名称、基板概略图 | ||||
Process copy | 制程复制 | Process files can be saved to flash disc or shared via LAN and used | ||
on machines with same models. | ||||
同型号机器间制程通用,通过移动存储复制或通过局域网共享 | ||||
Communication | 通信 | SMEMA,networked inline machine and rework sation(NG terminal)LAN consists of inline machine,rework station,offline programming station and server. | ||
通过SMEMA与上下游联机;在线机器和维修站(NG终端)联网;在线机器、维修站、离线编程式站和服务器可组成局域网。 | ||||
Conveying flow | 基板搬送流程 | B** or Return 穿过或反回 | ||
Reference position | 基准位置 | PCB Transport direction: from left to right,from right to right,from left to right or from rightto left(preset before shipment) | ||
基板传送方向:左至右、右至左、左至右或右至左(出厂时选择) |
(Hardware Configurations)硬件配置:
Post Printing 印刷后 | Post Mounting 贴装后 | Post reflow 焊接后 | |||
Vision system | Camera 摄像头 | 3CCD Di*al cameras 3CCD数字摄像头 | |||
图像系统 | Lighting system | Four color(R,G,B,W)programming and multi angle lighting | |||
照明系统 | 软件可编程四色(R,G,B,W)多角度LED照明 | ||||
Resolution 图像分辨率 | 20um/pixel,optional(可选):15um/pixel | ||||
FOV 视场 | 27.2mm×20.5mm(20um/pixel),20.4mm×15.4mm(15um/pixel) | ||||
Minimum inspected component | 0201(20um/pixel), | ||||
可检测*小元件 | Optional:01005(15um/pixel) | ||||
Mechanical | XY | Driving system | AC servo system plus precise ball leadscrew交流伺服系统﹢精密滚珠丝杆 | ||
System | Table | 驱动系统 | |||
机构部分 | XY | Positioning accuracy | &plu*n;8um | ||
平台 | 定位精度 | ||||
Positioning speed | 900mm/sec | ||||
定位速度 | |||||
Conveyor 传送方式 | Stepper motor driven belt conveyor 步进电机驱动的皮带传送方式 | ||||
Transport height 生产线高度 | 900&plu*n;20mm | ||||
Conveyor width adjust | Automated conveyor width adjust 自动调整 | ||||
轨道宽度调整 | |||||
Working temperature | 使用环境温度 | ﹢5~﹢40℃ | |||
Working humidity | 使用环境湿度 | 5﹪~90﹪ | |||
Air pressure | 气压 | 0.4—0.6Mpa 4—6kgf/C㎡ | |||
Power supply | 电源 | AC 1φ220V &plu*n;10﹪ 50—60HZ 2KW | |||
Dimensions | 尺寸 | L1160×W1230×H1640mm | |||
Weight | 重量 | 900kg |