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• Excellent protection against *D damage
• Low capacitance for high speed data lines
• Low leakage current
• Fast response time
• Bi-directional flip-chip design
• Gl* ceramic monolithic structure
• Silver termination with nickel and lead-free solder plating
• RoHS compliant
• Excellent protection against *D damage
• Low capacitance for high speed data lines
• Low leakage current
• Fast response time
• Bi-directional flip-chip design
• Gl* ceramic monolithic structure
• Silver termination with nickel and lead-free solder plating
• RoHS compliant
• Excellent protection against *D damage
• Low capacitance for high speed data lines
• Low leakage current
• Fast response time
• Bi-directional flip-chip design
• Gl* ceramic monolithic structure
• Silver termination with nickel and lead-free solder plating
• RoHS compliant