【厂价*】银浆柔性线路板/三层FPC
地区：广东 深圳
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上图产品银浆柔性线路板,
层数:三层
尺寸:500MM*40MM
板厚:0.38MM
*小孔径:0.5MM
*小线宽线距:0.3MM
用途:重工业
表面工艺:沉金工艺及银浆层
*工艺:线路复杂,尺寸面积大,对成形要求*高
打样:5天,批量7天,*小起订:1PCS
FPC制程能力标准
项目
| 内容 | 常规 | * |
1 | 层数 *.OF LAYER | 1～6层 | 8层 |
2 | 完成板尺寸(*大) FINISHED BOARD SIAE (MAX) | 250*650mm | OK |
3 | 完成板尺寸(*小) FINISHED BOARD SIAE (MIN) | 8mm*12mm | OK |
4 | 板厚度(*大) BOARD THICKN*S (MAX) | 23 mil (0.6mm) | OK |
5 | 板厚度(*小) BOARD THICKN*S (MIN) | 3 mil (0.0765mm) | （*焊）0.05mm |
6 | 成品厚度公差(0.085mm≦板厚<0.4mm) FIN*HED BOARD THICKN*S FOLERANCE (0.085MM≦BOARD THICKN*S<0.4mm) | &plu*n;2mil(&plu*n;0.05m) | OK |
7 | 钻孔孔径(*大) DRILL HOLE DIAMETER (MAX) | 240 mil (6.0mm) | 6.5mm |
8 | 钻孔孔径(*小) DRILL HOLE DIAMETER (MIN) | 8 mil (0.20mm) | 0.15mm |
9 | 外形精度 | &plu*n;0.1mm | &plu*n;0.05mm |
10 | 完成孔径(*小) For machine drill FIN*HED VIA DIAMETER (MIN) | 6 mil (0.15mm) | 0.10mm |
11 | 底铜厚度(*小) OUTER LAYER BASE COPPER THICKN*S (MIN) | 1/2OZ(18um) | 1/3OZ |
12 | 底铜厚度(*大) OUTER LAYER BASE COPPER THICKN*S (MAX) | 2OZ(72um) | 3OZ |
13 | *缘层厚度(*小) INNER LAYER DIELE*RIC THICKN*S (MIN) | 0.0127mm(PI厚1/2mil) | OK |
14 | *缘层厚度(*大) INNER LAYER DIELE*RIC THICKN*S (MAX) | 0. 50mm(PI厚2mil) | OK |
15 | 材料类型 BASE.MATERIAL | PI聚酰亚胺/PET聚脂 | 无胶基材 |
16 | 孔电镀纵横比(*大) HOLE PLATING ASPE* RATIO (MAX) | 5:1 | OK |
17 | 孔径公差(镀通孔) HOLE DIAMETER TOLERANCE (PTH) | &plu*n;3mil(&plu*n;0.076 mm) | OK |
18 | 钻孔孔径公差(非镀通孔) HOLE DIAMETER TOLERANCG (NPTH) | &plu*n;2mil(&plu*n;0.050mm) | OK |
19 | 孔位公差(与CAD数相比) HOLE POSITION TOLERAMCE (COMPARED WITH CAD DATA) | &plu*n;1mil(&plu*n;0.025mm) | OK |
20 | PTH孔孔壁铜厚 PTH HOLE COPPER THICKN*S | ≧0.5mil(≧12.5um) ≦1.0mil(≦25 um) | ≧8.0um |
