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深圳市美迪星电子有限公司是国内*生产轻触开关按键、拨动开关、五向开关、手机小侧按键、电源插座,耳机插座,U*插座,FPC/FFC扁平连接器的知名厂商之一。
始建以来,公司一直从事此类电子元器件的开发、研制和生产。公司在浙江设有大型的生产基地,拥有高级开发人员及技工二十多名,熟练生产员工五百多名,具备完善的产品开发、研制、生产及销售能力。公司拥有庞大完善的销售网络、具有*的服务,我公司将致力于为*电子整机生产企业提供高质量、高信誉的产品,*
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1.1. Content内容
This specification covers performance, tests and quality requirements forSECURE DIGITAL MEMORY CARD CONNE*OR.TYPE B These connectors areprovide space savings and improved functionality to system signal transfer.
此规范包括性能,测试及质量要求,适用于*数字记忆卡连接器,连接器提供完善的功能系统信号传输。
The following documents form a part of this specification to the extent specified herein. Unless otherwise specified, latest edition of the specification applies. In the event of conflict between requirements of this specification and product drawing, product drawing shall take precedence.
下列文件是一个组成部分,具体规定如下(2.1)。本规范和产品图纸发生冲突,以产品图纸为准。
2.1. Commercial standards, specifications and report 商业标准,规格及报告
2.1.1. MIL-STD-1344A 根据MIL - STD - 1344a标准
2.1.2. MIL-STD-202F 根据MIL - STD - 202f标准
3.1. Design and Construction 设计与装配
Product shall be of design, construction and physical dimensions specified on applicable product drawing.
产品应在设计,装配和结构尺寸指定适用产品图纸。
3.2. Materials and Finish 材料与整理
3.2.1. Contact : High performance copper alloy(Phosphor Bronze)
Finish : (a) Contact Area:Gold over Nickel.
(b) Solder Tail area:Tin/Lead or Tin only over Nickel.
(c) Underplate:50u" min. Nickel-platedall over
端子:*铜合金(磷青铜)
表面处理:(a)接触部分:打镍底,镀金。
(b)焊尾区:打镍底,镀纯锡。
(c)镀膜厚:镀镍50u ",镀锡30",镀金5".
3.2.2. Housing :LCP 30%G.F, UL94V-0.
胶芯材质:LCP 30%玻璃纤维,耐燃指数:UL94V - 0的。
3.3. Ratings 评级
3.3.1. Voltage : 100 Volts DC,AC(rms)100 Volts (per pin)
*大电压:100伏特直流,交流(rms).
3.3.2. Current : 0.5 Amperes DC (per pin)
*大电流:0.5安培直流.
3.3.3. Operating Temperature : -25℃TO 90℃
使用温度:-25℃至90℃
3.4. Performance and Test Description 性能及测试说明
Product is designed to meet electrical, mechanical and environmental performance requirements specified in Paragraph 3.5. All tests are performed at ambient environmental conditions per MIL-STD-1344A unless otherwise specified.
产品的目的是为了满足电气,机械和环境性能要求,在指定的第3.5节。*测试是在常压环境条件按照MIL –STD- 1344a除非另有说明。
3.5. Test Requirements and Procedures Summary 测试要求和程序,简易程序
Test Description 测试说明
| Finally测试结果 | Condition 测试条件
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ELE*RICAL电气 | ||||
Low-Signal Level Contact Resistance
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R<30 mΩ 电阻小于30mΩ
| Mate subject connector with compatible connector as shown in. MIL-STD-202F, Method 302
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Insulation Resistance *缘电阻测试
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R>1000MΩ *缘电阻大于1000MΩ | Apply DC 500&plu*n;10% Volts between adjacent contacts of mated connectors for one minute. MIL-STD-202F, Method 302 500&plu*n;10%伏特之间的相邻或接触交配连接器为一分钟。 | ||
Dielectric Withstanding Voltage 介质耐电压
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No discharge, flashover or breakdown. 没有放电,烧焦或击穿。 | 500 V initial and 250 Vfinal for 1 minute. MIL-STD-202F, Method 301 500V和250V持续一分钟. | ||
MECHANICAL机械 | ||||
Retention Force 端子保持力
| 100 Gram(0.98N)minimum(per pin) 100克(0.98n)(每针)
| Mate connector with a suitable gauge for each pin at rate of 25 mm/min. MIL-STD-1344A, Method 2012.1 用连接器与一个合适的拉力计,每个管脚在速度为25毫米/每分钟情况下。 | ||
Durability 寿命周期测试
| 10000 cycles. 插卡10000次以上。 | The sample should be mounted in theat the rate of25mm/min. MIL-STD-1344A, Method 2016 样品应装在试验机,在指定的速25mm/min。 | ||
Solderability 可焊性测试
| Solderable area shall have minimum of 95% solder coverage. 可焊面积大于95%
| Subject the test area of contacts into flux for 3&plu*n;0.5 seconds and then into solder bath, controlled at 270&plu*n;5℃, for 3&plu*n;0.5 seconds. 持需焊部分进入焊料浴,控制在270 &plu*n; 5℃,为3 &plu*n; 0.5秒。 | ||
ENVIRONMENTAL * | ||||
Salt Spray 氧化测试
| Oxidation of not more than 5‰ 氧化面积不*过5‰ | Subject mated/unmated connectors to5&plu*n;1% salt-solution concentration, 35℃&plu*n;2℃for 48 hours. MTL-STD-1344A, Method 1001.1,以5 &plu*n; 1%的盐溶液浓度,35℃&plu*n; 2℃,48小时。MTL-STD-1344A 1001.1 | ||
Temperature Life (Heat Aging) (Heat Resistance) 高温测试 | A.Products in 85℃&plu*n; 2℃96 hours, the product can still be used normally. products in 85℃&plu*n; 2℃96 hours, the product can still be used normally. B.Products in the 260℃&plu*n; 5℃or eight of the reflow temperature (maximum temperature of 260℃), the deformation of not more than 0.03 mm. A.产品在85℃&plu*n;2℃96小时,产品仍可正常使用. B.产品在260℃&plu*n;5℃或过八温段回流焊(*高温度260℃)后,变形不*过0.03mm. | MTL-STD-202F, Method 108A,
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广大客户的不同需求得到满足。
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美迪星
美迪星
手机
卡座
HDMI
SD
矩形
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11
11
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