供应单相.三相桥模块MDQ.MDS

品牌:ZL 型号:mds mdq 封装形式:贴片 装配方式:通孔插装 封装材料:金属封装 结构:面接触型 材料:硅 功率特性:大功率 应用范围:整流

出口外型（SANREX型）（FUJI型）（IR型）（SEMIKRON型）等等

单相桥MDQ；三相桥 MDS

电流40A 60A 80A 100A 150A 200A 250A

400V~1800V

“真空+充气保护”焊接技术

*的力量/体积比率

高热的传导性封装

芯片与底板电气*缘2500V交流电压

安装简单，使用维修方便。

*高工作温度150C，正向压降小

Detailed Product Description

International Rectifier(IR) t*e and Semikron, Sanrex t*e, 3-phase bridge rectifier or Single phase bridge rectifier modules 60A~100A, also have white cover. MDS, DF, MDQ, VUO

Features
base & chip insulation AC voltage 2500V
international standard packing
excellent temperature feature
easy install
volume *all,weight light
highest operating temp 140
low VFM

Applications
instrument s D C power supply
PWM frequency transformet
input rectificate power supply
DC motor field power supply
switch power supply input rectificate

Explanation

1. IGT,VGT,IH are all TA=25'C test data,others are all TA=Tjm test data.
2. I2t=I2TSM X TW/2 :TW =Half sine wave current,when at 50Hz, I2t=0.005 I2TSM(A2S)

3. when at 60Hz,ITSM (8.3ms)=ITSM (10ms)X 1.066,Tj=T jm
I2t (8.3ms)=I2t (10ms)X 0.943,Tj=T jm

T*e Id @ Tc VRRM VFM@IFM IRRM IF(*) IF(RMS)

A 'C V V A mA A A

MDQ0 600. 10 80 106

MDQ0 600.50 57

MDS0 600.47 60 71

MDS0 600. 10 80 105

T*e IFSM Rjc Tjm Viso Outline

A*1000 'C/W 'C VAC

MDQ..55 M14

MDQ..32 M14

MDS..24 M14

MDS..55 M14