供应快速抄板*
地区：广东 深圳
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|
层数 |
Layers | 2-22(层)Layers |
|
*大*面积 |
Max.Board Size | 23inch * 35inch |
|
板厚 |
Board Thickness | 0.4-6.0mm |
|
*小线宽 |
Min.Line Width | 0.10mm |
|
*小间距 |
Min.Space | 0.10mm |
|
*小孔径 |
Min.Hole Size | 0.15mm |
|
孔壁铜厚 |
PTH Wall Thickness | >0.025mm |
|
金属化孔径公差 |
PTH Hole Dia.Tolerance | ±0.05mm |
|
非金属化孔径公差 |
Non PTH Hole Dia.Tolerance | ±0.05mm |
|
孔位公差 |
Hole Position Deviation | ±0.076mm |
|
外形尺寸公差 |
Outline Tolerance | ±0.1mm |
|
开槽 |
V-cut | 30°/45°/60° |
|
*小BGA焊盘 |
Min.BGA PAD |
14mil |
|
PCB交流阻*控制 |
Impedance control PCB | ≤50Ω ±5Ω |
| ＞50Ω ±10% | ||
|
阻焊层*小桥宽 |
Soldemask Layer Min.Bridge width | 5mil |
|
阻焊膜*小厚宽 |
Soldemask film Min.Thickness | 10mil |
|
*缘电阻 |
Insulation Resistance | 1012Ω(常态)Normal |
|
*剥强度 |
Peel-off Strength | 1.4N/mm |
|
阻焊剂硬度 |
Soldemask Abrasion | >5H |
|
热衡击测试 |
Soldexability Test | 260℃20(秒)second |
|
通断测试电压 |
? E-test Voltage | 50-250V |
|
介质常数 |
? Permitivity |
? ε=2.1~10.0 |
|
体积电阻 |
? Volume resistance | ?1014Ω-m,ASTM D257,IEC60093 |
|
SMT焊接*小间距 |
SMT Jointing Min.Space | 0201mm |
|
QFP间距 |
QFP Space | pitch 0.3mm |
|
*小封装 |
Min.Package | 0201 |
|
*小板面积 |
Min.Size | 50mm x 50mm |
|
*大板面积 |
Max.size | 350mm x 550mm |
|
贴片精度 |
Placement precision | ±0.01mm |
|
贴片范围 |
Placement rang | QFP,SOP,PLCC,BGA |
|
贴装能力 |
Placement capability | 0805,0603,0402,0201 |
|
柔性板 |
Flexible Board | 2-6层 |
|
*小线宽/间距 |
Min.Line Width/Space | 0.075mm |
|
*小孔径 |
Min.Hole Size | 0.20mm |
|
外形公差 |
Outline Tolerance | 钢磨±0.1mm ，刀磨±0.3mm |
|
表面处理 |
Surfce treatment on Terminal and Area | *氧化(*型）；镀钝锡；沉钝锡；喷钝锡；镀镍金；沉镍金 |
|
品质标准 |
Quality Standard | *-A-600F/MIL-STD-105D |
2006
FY
