供应经销ROGERS罗杰斯板材

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深圳市诚逸隆科技供应经销ROGERS罗杰斯板材,公司只做原装,假一赔十

 

3001 Bonding Film (Thermoplastic Chloro-fluorocopolymer)
Recommended for bonding low dielectric constant PTFE  microwave stripline packages and other multilayer circuits. It may also be used to bond other structural and electrical components to the dielectric.

RO3000® and RO3200™ series High Frequency Laminates (PTFE/Ceramic)

High frequency circuit materials used in commercial microwave and RF applications. They offer exceptional electrical and mechanical stability at competitive prices.

RO4000® Series High Frequency Circuit Materials (Woven glass reinforced, ceramic filled thermoset)
Laminates and prepregs designed to offer superior high frequency performance and low cost circuit fabrication. The result is low loss materials that can be fabricated using standard epoxy/glass (FR4) processes offered at a competitive price.

RT/duroid® 5870/5880 Glass Microfiber Reinforced PTFE Composites

These materials are designed for exacting stripline and microstrip circuit applications.

RT/duroid® 6002, 6202, 6006, 6010 PTFE/Ceramic Laminates
Offered in four grades. RT/duroid® 6002, 6202, 6006 and 6010 laminates are ceramic-PTFE composites offering superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.

TMM® Thermoset Microwave Laminates (Thermoset ceramic loaded plastic)

Designed for high reliability stripline and microstrip applications. TMM laminates are available in a wide range of dielectric constants and claddings.

ULTRALAM® 2000 Woven Glass PTFE Laminates

Microwave laminates designed for high reliability stripline and microstrip circuit applications.

ULTRALAM® 3000 Series Liquid Crystalline Polymer Circuit Materials
A double-clad copper laminate, with the temperature resistant liquid crystalline polymer as a dielectric film.

 

 

LONGLITE™ Flex 200 Adhesiveless Materials
Single sided, adhesiveless laminates specifically designed for thinner flex circuit constructions.

LONGLITE™ Flex 300 Adhesiveless Series
Thin dielectric, double-clad, adhesiveless laminates designed to meet today's high performance inteconnection requirements.

R/flex® 1000 Circuit Materials for Long-life Dynamic Flexing
High performance polyimide film-based laminates with rolled annealed copper foil and coversheets ideally suited for constructing single and double sided flexible circuitry.

R/flex® 1100 Circuit Materials - High Temperature Laminates
High performance flexible circuit material system, designed for use in harsh, high temperature environments.

R/flex® 1500 Assembly Adhesive
Unsupported (without backing) dry film adhesive especially designed to meet the demanding requirements of electronics assembly operations.

R/flex® 2001 Laminates and Coverfilms
High performance circuit material system, especially formulated for high peel strength and IPC-FC-241 and 232/1 performance.

R/flex® 2005 Laminates and Coverfilms
Material system consisting of polymide film based laminates with rolled annealed copper foil, cover sheet, bonding film. Delivers:

  • wide process latitude
  • high bond strength
  • solvent resistance
  • improved electrical performance in critical applications due to low moisture absorption and closely controlled adhesive thickness

R/flex® 8080 Liquid Photoimageable Covercoat
Enables ultra-fine patterns needed for today's high-density flexible printed circuits Designed for manufacturing high precision patterns unattainable through conventional screen printing. Provides uniform coverage and reliable performance in mass production processes.

R/flex CRYSTAL® Laminates and Coverlayers
Flame retardant epoxy adhesive technology base on a new film Copper-clad laminates with rolled annealed and electrodeposited copper foils well suited for constructing single and double sided flexible circuitry.

R/flex JADE® Series
Flexible copper-clad laminate material – the next generation of industry-leading R/flex CRYSTAL® epoxy Halogen-free flame retardant flexible material engineered especially to meet increasing environmental requirements without compromising performance in today's demanding flexible circuit designs.

  • HT-1200 series - General Purpose Silicone Rubber
  • HT-6000 Series - Peformance Solid Silicones

PORON® Microcellular Urethanes for Gasketing and Sealing Products

  • PORON® 4701-30
    Very soft, easily compressed for use where flexibility is a key requirement.  Standard available  thickness range from 0.021"
  • PORON® 4701-40
    Soft material for a wide variety of applications.  Standard available thickness range from 0.031" to 0.500" (0.79 mm to 12.7 mm).
  • PORON® 4701-41
    Soft, enhanced sealability material offering greater closed-cell content for demanding vacuum sealing applications or low closure-force requirements.  Standard available thickness range from 0.031" to 0.500" (0.79 mm to 12.7 mm).
  • PORON® 4701-50
    Firm material used for managing high energy impact with gasketing needs.  Standard available thickness range from 0.012" to 0.500" (0.30 mm to 12.7 mm). 
  • PORON® 4701-60
    Very firm material used for energy management solutions for enclosure gasketing applications.  Standard available thickness range from 0.021" to 0.500" (0.53 mm to 12.7 mm)
  • PORON® 4790-92
    Extra soft, slow rebound with the lowest closure force.  Standard available thickness range from 0.021" to 0.500" (0.53 mm to 12.7 mm).
  • PORON® Soft Seal
    Designed for superior sealing at 6 pounds per cubic foot, this material is the lowest density offering in the PORON urethane product line.
  • PORON® ThinStik™ 92-12 Series
    PORON ThinStik is an all-in-one solution, combining Rogers’ industry leading 92-12 PORON Urethane with a pressure-sensitive adhesive layer built right into its construction. This innovation enables higher compressibility than traditional laminated adhesive constructions to help designers meet the demands of ultra-thin gap-filling applications.

PORON® Microcellular Urethanes for Gasketing and Sealing Products

  • PORON® 4701-30
    Very soft, easily compressed for use where flexibility is a key requirement.  Standard available  thickness range from 0.021"
  • PORON® 4701-40
    Soft material for a wide variety of applications.  Standard available thickness range from 0.031" to 0.500" (0.79 mm to 12.7 mm).
  • PORON® 4701-41
    Soft, enhanced sealability material offering greater closed-cell content for demanding vacuum sealing applications or low closure-force requirements.  Standard available thickness range from 0.031" to 0.500" (0.79 mm to 12.7 mm).
  • PORON® 4701-50
    Firm material used for managing high energy impact with gasketing needs.  Standard available thickness range from 0.012" to 0.500" (0.30 mm to 12.7 mm). 
  • PORON® 4701-60
    Very firm material used for energy management solutions for enclosure gasketing applications.  Standard available thickness range from 0.021" to 0.500" (0.53 mm to 12.7 mm)
  • PORON® 4790-92
    Extra soft, slow rebound with the lowest closure force.  Standard available thickness range from 0.021" to 0.500" (0.53 mm to 12.7 mm).
  • PORON® Soft Seal
    Designed for superior sealing at 6 pounds per cubic foot, this material is the lowest density offering in the PORON urethane product line.
  • PORON® ThinStik™ 92-12 Series
    PORON ThinStik is an all-in-one solution, combining Rogers’ industry leading 92-12 PORON Urethane with a pressure-sensitive adhesive layer built right into its construction. This innovation enables higher compressibility than traditional laminated adhesive constructions to help designers meet the demands of ultra-thin gap-filling applications.

PORON Medical® Urethanes Products

  • DermaBak® Advanced Dermal Materials
    Specifically designed for use in wound dressing backings, DermaBak foam membranes provide long-term comfort, good conformability and breathability, and low coefficients of friction with minimum staining and soiling. These materials can also be used in transdermal patches, IV site dressings, and EKG pads.
  • PORON Medical® Urethane - Firm - Energy Absorbing

PORON Medical® Urethanes offer high-energy return and excellent impact absorption.

  • PORON Medical® Urethane - Slow Recovery - Custom Contouring
    PORON Medical® Slow Recovery urethane is a unique custom contouring material. This material rebounds slowly when compressed, which results in a custom fit or contour during each use. The material will continue to return to its original shape when not in use. Slow Recovery is available in Soft, Very Soft, Firm and Very Firm.
  • PORON® 4708 Soft Cushioning

PORON 4708 Soft Cushioning materials have a density of 15 pounds per cubic foot. 

  • PORON® 4708 Soft Supporting

PORON 4708 Soft Supporting materials have a density of 20 pounds per cubic foot.


高频印制板(HFPCB):适用微波传输电子产品
单面印制板(SPCB):基材FR4
双面印制板(SPCB):基材FR4
多层印制板(MPCB):基材FR4PP
高密度印制板(HDIPCB):含埋/盲孔,适用BGA电子产品
铝基印制板:适用大功率散热电子产品
 

 产品类型
单面板/双面板/多层板3-16
常用基材
高频板材FR-4CEM-3
铝基板材
陶瓷板材
板厚度
内层芯片0.10-1.50mm
总厚度 0.20-5.0mm
板厚公差
内层芯最大公差
  ±0.08mm
总厚度公差
  ±0.15mm
铜箔厚
  17-175μm

最大加工面积  1100×500mm
最小产品面积
  2×2mm
最小孔径
  0.2mm/8mil
最小线宽  0.10mm/5mil
最小间距  0.10mm/5mil
阻焊油墨 (TamuraDsr-2200NANIALP-3GSolder Mask
外形加工精度
  0.15mm
表面处理
喷锡沉金
 
      镀镍/金(硬金) OSP涂膜(抗氧化板)
内层对位公差
  ±0.10mm

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