供应DC插座/电源插座

ITEM

项 目

SOLDERING CONDITIONS

焊接条件

(1)PREHEAT TEMPERATURE

预热温度

100℃ MAX

(A*ENT TEMPERATURE OF PRINTED CIRCUIT BOARD ON ITS SOLDERING SIDE)(电路板周围焊锡面的温度)

(2)PREHEAT TIME

预热时间

45 SEC MAX

45秒MAX

(3)FLUX FOAMING

助焊剂浸泡

TO SUCH AN EXTENT THAT FLUX WILL BE KEPT FLUSH WITH THE PRINTED CIRCUIT BOARDS,TOP SURFACE ON WHICH COMPONENTS ARE MOUNTED.PRDPARATORY FLUX MUST *T BE APPLIED TO THAT SODE OF PRINTED CIRCUIT BOARD ON WHICH COMPONENTS ARE MOUNTED AND TO THE AREA WHIERE TERMINALS ARE LOCATED.

助焊剂应涂在电路板上组装开关的印刷面上半部位，应*助焊剂过量到电路板.

(4)SOLDERIN

TEMPERATURE

焊锡温度

255℃ MAX

255℃ MAX

(5)DURATION OF SOLDER IMMERSION

焊接时间

5 SEC MAX

5秒 MAX

(6)ALLOWABLE

PREQUENCY

允许重焊次数

2 TIM* MAX

2次 MAX