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1.Material:
1.1 Housing:HI-Temp plastic.
1.2 Contact:Copper Alloy(C5191H t=0.15mm).
2.Specification:
*Electrical Characteristics:
2.1 Current Rating:0.5A.
2.2 Voltage Rating:250V AC/DC
2.3 Dielectric Withstanding Voltage:AC 250V r.m.s.
2.4 Insulation Resistance:1000 M?minimum
at DC 250V.
2.5 Contact Resistance:100 m?maximum.
*Mechanical Performance:
2.6 Micro SD Card extraction force: 1.0N MIN.
2.7 Durability: 10,000 mating cycles.
*Environmental:
2.9 Operating Temperature:-20°~85°
3. Ordering Information:
国产
TF PUSH PUSH
手机
卡座
U*
单卡
TF
矩形
熔接
*爆
C5191
LCP
9
9
14.5(mm)