LED模块/组件/点阵/芯片/支架

1.Material:
1.1 Housing:PP.
1.2 Contact:Copper Alloy

1.3 Grounding:Copper Alloy

*FINISH:
2.1 CONTA*S: GOLD FLASH IN(SEE: P/N) CONTA* AREA.
   100U"MIN. TIN PLATING ON SOLDER TAILS.
    50u" MIN. NICKEL UNDERPLATED ALL OVER.
2.2 Grounding: GOLD FLASH IN(SEE: P/N) CONTA* AREA.
   100U"MIN. TIN PLATING ON SOLDER TAILS.
    50u" MIN. NICKEL UNDERPLATED ALL OVER.
2.3 SHELL: GOLD FLASH ON SOLDER TAILS.
    100U"MIN. NICKEL ON AREA .
3.Specification:
 *Electrical Characteristics:
3.1 Current Rating:0.5A.
3.2 Voltage Rating:250V AC/DC
3.3 Dielectric Withstanding Voltage:AC 500V r.m.s.
3.4 Insulation Resistance:1000 M?minimum
   at DC 500V.
3.5 Contact Resistance:100 m?maximum.
 *Mechanical Performance:
3.6 Contact Retention Force:3.0N min./per contact
3.7 Mating Force:9.8N Max
3.8 Unmating Force:1.47N min and 9.80N max
 *Environmental:
3.9 Operating Temperature:-20°~85°
4.  Ordering Information: